ESD Shielding Plastic Packaging Bag for Electronic Component

• Making Process：Composite Packaging Bag
• Shape：Open Top, Zip Lock, Gusset Bag
• Material：Laminated Material
• Feature：Moisture Proof, Antistatic
• Application：PC Board, IC, CD Driver, HD Pack
• Raw Materials：APET,PE APET,CPP

=== Base Info ===

• Specification：SGS ROHS report
• Transport Package：50 - 100PCS Per Bag, 5 - 50 Bags , Carton
• Bag Type：Open Top, Zip Lock
• Surface Handling：Gravure Printing
• Color：Semi-Transparent
• Industrial Use：Electronic Components, Semiconductive Industry
• Function：Anti Static
• Bag Variety：Open Top Bag, Zip Lock Bag
• Model NO.：SZ-S001
• Trademark：DIASAP
• Origin：Suzhou, China
• HS Code：3923210000
• Production Capacity：200000 PCS,Day

=== Description ===
Product Description:Product NameESD Shielding Plastic Packaging Bag for Electronic Component Material StructureLayers Laminated Materials
PET-AL/PE            PET-AL/CPPFeatureAnti-static, moisture barrierPrintingcustomizedSurface Resistance10^6~10^11 OhmThicknessCustomizedBag StyleOpen top/zip lockPackage50~100pcs per bag and then in cartons or as per customer's requestUsageElectronic products which are sensitive to static, such as PC board, IC integrated circuit ,CD driver, HD packaging. 
Technical Parameters: