ESD Moisture Barrier Bag for Integrated Chip Packaging

• Material：Laminated Material
• Shape：Open Top, Ziplock, Three Dimensional, Gusset
• Feature：Moisture Proof, Shock Resistance, Antistatic, Light Isolation
• Application：Food, Promotion, Household, Chemical, Apparel, Pricise Equipment, PC Board, IC, CD Driver
• Making Process：Composite Packaging Bag
• Raw Materials：Pet,Al,Ny,PE BOPP,Al,PE

=== Base Info ===

• Transport Package：50 - 100PCS Per Bag, 5 - 50 Bags , Carton
• Bag Type：Open Top, Zip Lock, Three Dimensional, Gusset
• Surface Handling：Gravure Printing
• Color：Silver
• Industrial Use：Electronic Components, Semiconductive Industry
• Function：Anti Static, Moisture Barrier, Light Isolation
• Bag Variety：Open Top, Ziplock, Three Dimensional, Gusset
• Model NO.：SZ-MB002
• Specification：SGS ROHS report
• Trademark：DIASAP
• Origin：China Suzhou
• HS Code：3923210000
• Production Capacity：200000 PCS,Day

=== Description ===
Product DescriptionProduct NameESD Moisture Barrier Bag for Integrated Chip Packaging 
Material StructureLayers Laminated Material:
 
PET/AL/NY/PE  BOPP/AL/PE FeatureAnti-static, moisture barrier,light isolationPrintingCustomizedSurface Resistance10^6~10^11 OhmThicknessCustomized(0.06--0.2mm available)  Bag StyleOpen top/ zip lock/ envelope/ gusset/ three dimensionalPackage50~100pcs per bag and then in cartons or as per customer's requestUsageElectronic components (PCB, IC, HD driver),precise equipment
and chemical raw material etc. Technical Parameters: