Metal Laser Dicing Machine with Ultra Precision

• After-sales Service：Online Technique Support
• Warranty：1 Year
• Application：Environmental Equipment, Petroleum Machinery Manufacturing, Aerospace Industry, Automotive Industry
• Cooling System：Air Cooling
• Technical Class：Continuous Wave Laser
• Applicable Material：Metal

=== Base Info ===

• Model NO.：CW- UV3030
• Structure Type：Gantry Type
• Laser Classification：Free Electron Laser
• Laser Technology：Laser Control Fault Cutting
• Laser Source：UV
• Transport Package：Wood Package
• Trademark：Chanxan
• Origin：China
• HS Code：8456110090
• Production Capacity：50000 Pieces,Year

=== Description ===

Metal Dicing

Dicing of metal wafers that include copper, copper-tungsten, moly and stainless steel is done on wafers and thin films using IPG's proprietary technology. Beam delivery can be optimized from standard focused beams to proprietary shaped beams to allow for optimization of throughput and quality. Shown here is copper wafer cutting for device singulation.

System: Metal Wafer Cutter

Lasers: Single-mode QCW lasers, multi-mode QCW lasers, picosecond lasers, UV ns pulsed lasers