OEM ODM Packaging for Headset / Headphone / Earphones

=== Base Info ===

• Thickness of Blister：0.35mm, 0.4mm,0.45mm, Special
• Raw Materials：High Pressure Polyethylene Plastic Bag
• Making Process：Composite Packaging Bag
• Shape：Special Bag
• Lead Time：Sample 3 to 5days, Mass Productions 10
• Thickness：Range Box with Printing: 0.15mm-0.8mm; Box Without
• Design：Costomized
• Material and Finishing：According to Your Requiremnts
• Type：as Custom
• Printing Page：Single
• Material：Plastic
• Application：Electronic
• Model NO.：KH-B0546
• Bag Variety：Back Seal Bags
• Sample：5 Working Days, Charge USD120 Per Item
• Trademark：Koohing
• Transport Package：Kraft Paper, Waterproof and as You Required
• Specification：SGS
• Origin：Shenzhen, China
• HS Code：3923100000

=== Description ===