Moisture Proof Bags for Packaging PC Boards

• Shape：Open Top, Ziplock, Three Dimensional, Gusset
• Material：Laminated Material
• Feature：Moisture Proof, Shock Resistance, Antistatic, Light Isolation
• Application：Promotion, Chemical, Pricise Equipment, PC Board, IC, CD Driver
• Making Process：Composite Packaging Bag
• Raw Materials：Pet,Al,Ny,PE BOPP,Al,PE

=== Base Info ===

• Transport Package：50 - 100PCS Per Bag, 5 - 50 Bags , Carton
• Bag Type：Open Top, Zip Lock, Three Dimensional, Gusset
• Surface Handling：Gravure Printing
• Color：Silver
• Industrial Use：Electronic Components, Semiconductive Industry
• Function：Anti Static, Moisture Barrier, Light Isolation
• Bag Variety：Open Top, Ziplock, Three Dimensional, Gusset
• Model NO.：SZ-MB002
• Specification：SGS RoHS report
• Trademark：DIASAP
• Origin：China Suzhou
• HS Code：3923210000
• Production Capacity：200000 PCS,Day

=== Description ===
Product DescriptionProduct NameMoisture Proof Bags for Packaging PC Boards 
Material StructureLayers Laminated Material:
 
PET/AL/NY/PE  BOPP/AL/PE FeatureAnti-static, moisture barrier,light isolationPrintingcustomizedSurface Resistance10^6~10^11 OhmThicknessCustomized(0.06--0.2mm available)Bag Styleopen top/ zip lock/ envelope/ gusset/ three dimensionalPackage50~100pcs per bag and then in cartons or as 
per customer's request 
UsageElectronic components (PCB, IC, HD driver),precise equipment
 and chemical raw material etc.
  
 
 Technical Parameters:

NO.	Item	Standard	Result
1	Puncture Strength	MIL-STD-3010B	≥24LBF
2	Surface resistivity	ASTM D-257	10^6-10^11ohm
3	Decay time	IEC61340-5-1	<0.3s
4	WVTR	ASTM F1249	≤0.0006g/100in²/24hs
5	OTR	ASTM D3985	≤0.01cc/100in²/24hs
6	Heat-Seal Temperature		160%±10%
7	Heat-Seal Pressure		70Pa
8	Heat-Seal Time		≤1.5S

 
 Product Pictures: 



Factory Show:
 

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Free samples will be sent for your evaluation!