ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing

Foshan Shunde Topcod Industry Co., Ltd. / 2022-06-09

ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing

  • Shape:Seal Bag
  • Material:Laminated Material
  • Feature:Moisture Proof, Recyclable, Shock Resistance, Antistatic, Dustproof
  • Application:Promotion, Household, Chemical, Industrial Use
  • Making Process:Composite Packaging Bag
  • Raw Materials:High Pressure Polyethylene Plastic Bag

=== Base Info ===

  • Trademark:TOPCOD,OEM
  • Specification:Customized
  • Transport Package:Carton
  • Peel Strength:>3.0n, 15mm
  • Puncture Resistance:>100n
  • Thickness:0.14mm, 0.2mm, etc
  • Layers:Pet,Al,Ny,PE
  • Printing:Blank or Customized
  • Bag Variety:Upright Bag
  • Model NO.:TP- packing bag
  • Origin:China
  • HS Code:3923290000
  • Production Capacity:10000PCS,Day

=== Description ===
140±10μmLay 1 (Surface)Polyester (PET)12μmLay 2Aluminum foil (AL)7μmLay 3Nylon (NY)15μmLay 4 (Base)Polyethylene (PE)100μm

3-Specifications:Item NameMoisture Proof Aluminum Foil Bag With 4 LayersProduct SizeCustomizedShapeUpright bag,organ bag, back seal bagPrintingBlank or CustomizedPackagingCarton PackagingStructurePET/AL/NY/PE (Surface-Base)Thickness> 0.14 mmSeal Strength> 30N/ 15mmPeel Strength>3.0N/ 15mmPuncture Resistance>100NVapor Transmission0.002mg/100 in/24hTensile Strength Vertical >75N/ 15mm
Horizontal >85N/ 15mm
Heat-seal ConditionTemperature: 300-400F
Time: 0.6-4.5 seconds
Pressure: 30-70 PSI
Antistatic Performance1x105Ω< Outer surface<1x109Ω
1x105Ω< Inter surface<1x1011Ω
Metal layer<1x100Ω

4-Applications
Packaging of various PCB, IC, LED, hard disk, electronic parts and components, semiconductor,etc.
ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing

ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing

5-Company Display:

1: Established in 2001 with 18 years' experiences in this industry.
2: Combines R&D, production and sale together.
3: Owns 
advanced mechanized production line.
4: Product range: kinds of desiccants, humidity indicator card, Aluminum foil bag and other packing material.

ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing
ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing
ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing


6-Other hotselling products:
ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing

7-International Packaging Show
ESD Moisture Barrier Aluminum Foil Bag for IC Chips/Wafer/LED Packing

8-FAQ:
Q1: Can I have samples first before placing orders?A1: Yes, we can offer you free samples and welcome your trial order.
 

Q2: When can I have the sample? How about the mass order?
A2: Usually the delivery of sample is 3-5 working days, and 15-20 days for the mass order.
 
Q3: Can you accept to print our own logo or brand on your products?

A3: Yes, customized style are welcomed here.

Q4:What is the packaging ?
A4:Carton packaging, the dimension is up to the product size.

Copyright 2024 357th.com All Rights Reserved