Toco Motion Linear Module for Laser Processing Applications

Xiamen Bestlink Factory Co., Ltd. / 2022-06-27

Toco Motion Linear Module for Laser Processing Applications

  • Standard or Nonstandard:Standard
  • Feature:3c
  • Application:Textile Machinery, Packaging Machinery, Food Machinery
  • Surface Treatment:Oxygenation
  • Material:Aluminum
  • Body Width:54mm to 82mm

=== Base Info ===

  • Model NO.:TGB
  • Max Stroke:800mm to 1000mm
  • Max Playload:30kg to 50kg
  • OEM:Yes
  • Driven:Ball Screw
  • Sealed Structure:Yes
  • Transport Package:Carton Box or Wooden Case
  • Specification:TGH5, TGH8, TGH12
  • Trademark:TOCO
  • Origin:China
  • HS Code:8487900000
  • Production Capacity:500 Sets,Month

=== Description ===
BrandTOCO MOTIONModelTGBSize customizeTGB5,TGB6,TGB10,TGB12,TGB13,TGB14,TGB17,TGB22HS-CODE8487900000Items packingPlastic bag+Cartons Or Wooden Packing Payment termsT/T, Western UnionProduction lead time15 business days for sample, 35 days for the bulkKeywordSingle axiseApplication1. Automatic controlling machine
2. Semi-conductor industry
3. General industry machinery
4. Medical equipment
5. Solar energy equipment
6. Machine tool
7. Parking system
8. High-speed rail and aviation transportation equipment, etc.


Catalogs
Toco Motion Linear Module for Laser Processing ApplicationsToco Motion Linear Module for Laser Processing ApplicationsToco Motion Linear Module for Laser Processing Applications







Package & Shipping
1.Package: Carton or wooden case.
2.Delivery time: 15 days after receiving payment.
3.Shipping: by express (DHL, TNT, FedEx, etc.) or by sea.

TOCO Exhibition
Toco Motion Linear Module for Laser Processing Applications


Taiwan brand registered trademark, High-Tech Enterprise, letter patents, and ISO.
Toco Motion Linear Module for Laser Processing Applications

Toco Motion Linear Module for Laser Processing Applications

Our factory
Toco Motion Linear Module for Laser Processing ApplicationsToco Motion Linear Module for Laser Processing ApplicationsToco Motion Linear Module for Laser Processing Applications

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