Diamond Cutting Blade for Wafering and Dicing

Qingdao Aohai Ruitai Industrial Co., Ltd. / 2022-06-27

Diamond Cutting Blade for Wafering and Dicing

    === Base Info ===

    • Model NO.:1A1, 1A8, 1A1W, 1A1R
    • Kind:Diamond Wheel
    • Manufacturing Arts:Sinter
    • Usage:Stone Cutting, Plastics, Laminate Plate, Semiconductor Cutting, Lab Use Super-thin Saw Blade, Optical Glass Cutting, Fire-Retardant, Porcelain, Drilling, Arts Cutting, Engineering Material
    • Saw Blade External Diameter:150mm

    === Description ===

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