Starland Sutomatic Rolled Sugar Cone Machine (CBIV-55*2A)

• Voltage：380V
• Type：Oven
• Timing Device：Without Timing Device
• Power Source：Gas
• Usage：Biscuit
• Customized：Customized

=== Base Info ===

• Specification：8.80 X 2.25 X 1.60meter
• Transport Package：Stainless Steel
• Shipping Volume：34 Cbm , 40 Ft Container
• Total Weight：4,800kgs
• Machine Measurement：8.80 X 2.25 X 1.60meter
• Capacity：6,000-6,600 PCS,Hour
• Model NO.：CBIV-55*2A
• Trademark：STARLAND
• Origin：Guangdong Guangzhou
• Production Capacity：6, 000-6, 600 PCS,Hour

=== Description ===
 CBI-47A*/CBI-47X2A*CBI-71A*/CBI-71X2A*CBI-107A*/CBI-107X2A*Number of baking plates4771107Standard Cones/hour**420066009500Gas Consumption(kg)/hour5-69-1011-12Machine Dimension(mm)6700L*2400W*1800H9600L*2400W*1800H13900L*2400W*1800HMachine Weight(kg)450065009600Main Motor specification1.5hp;1.1kw2.0hp;1.5kw2.0hp;1.5kw
CBIII series and WBIII series
(Baking Plares Size:320mmX240mm;suitable for cones length over 125mm  and waffle basket)
  CBIII-39A*/CBIII-39X2A*CBIII-55A*/CBIII-55X2A*CBIII-61A*/CBIII-61X2A*Number of baking plates395561Standard Cones/hour**350055006000Gas Consumption(kg)/hour5-69-1010-11Machine Dimension(mm)7000L*2400W*1800H9500L*2400W*1800H10500L*2400W*1800HMachine Weight(kg)470065008500Main Motor specification1.5hp;1.1kw2.0hp;1.5kw2.0hp;1.5kw
CBIV series and WBIV series
(Baking Plares Size:260mm*240mm;suitable for cones length  between 100mm to 120mm and waffle basket)
  CBIV-45A*/CBIV-45X2A*CBIV-63A*/CBIV-63X2A*CBIV-97A*/CBIV-97X2A NEW*Number of baking plates456397Standard Cones/hour**400060009000Gas Consumption(kg)/hour5-69-1011-12Machine Dimension(mm)6800L*2400W*1800H9000L*2400W*1800HTo be confirmedMachine Weight(kg)4500650010000Main Motor specification1.5hp;1.1kw2.0hp;1.5kw2.0hp;1.5kw
*Ameans one cone per baking plate while x2A means two cones per baking plate
** Standard cone is 23° with cone length 110mm; standard cone /hour for x2A(two cones per baking plate) only.
Also, production output depends on the quality of cone mix, oven tempreature and thickness of wafer.