Resin Bonded Diamond Grinding Wheels

• Manufacturing Process：Sintered
• Shape：Flat-Shaped
• Bonding Agent：Resin
• Material：PCD
• Transport Package：Wood Carton
• Specification：Diameter 25mm-250mm

=== Base Info ===

• Model NO.：Diameter 50mm~250mm
• Trademark：HG
• Origin：China
• HS Code：6804221000
• Production Capacity：10000pieces,Year

=== Description ===

Basic Info.

Model NO. Diameter 50mm~250mm Trademark HG Origin China HS Code 6804221000 Production Capacity 10000pieces/Year

Product Description

Resin Bonded Diamond Grinding Wheels



1.Ceramic bond diamond grinding wheel
Appliable material: Semiconductor wafers and solar wafers, PCD (drill bits),CVD,PCBN,tungsten carbide,engineering structural ceramics,gem,crystal,magnetic material and other hard and brittle material.

2.Resin bond diamond grinding wheel
Appliable material :Non metallic materials,tungsten carbide, ceramic, agate, optical glass, semiconductor materials,cast iron,stone and so on.

3.Metal bond diamond grinding wheel
Appliable material:Glass,ceramic,silicon wafer,floor slab,marble,granite,concrete,semiconductor materials and super hard materials.

4.Features
Good for non metallic materials.
High efficiency and low consumption.
High accuracy.
Good thermal conductivity.
Good self-sharpening.
Less heat in grinding, fewer burned workpiece.
Predictable quality and shape for the workpiece.