Resin Bond Diamond Back Grinding Wheels for Silicon Wafer Thinning
Linyi Kexin International Trade Co., Ltd. / 2022-06-27
=== Base Info ===
- Model NO.：Requirements
- Manufacturing Process：Sintered
- Shape：Cylindrical
- Bonding Agent：Resin
- Abrasive：Diamond
- Application：Silicon Wafer Thinning
- Trademark：Moresuperhard
- Transport Package：Carton Box
- Specification：Requirements
- Origin：China
- HS Code：8207901000
=== Description ===
New product
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