- Manufacturing Process:Sintered
- Shape:Flat-Shaped
- Bonding Agent:Resin
- Material:PCD
- Transport Package:Wood Carton
- Specification:Diameter 25mm-250mm
=== Base Info ===
- Model NO.:Customized
- Trademark:HG
- Origin:China
- HS Code:6804221000
- Production Capacity:10000pieces,Year
=== Description ===
Basic Info.
Model NO.
Customized
Trademark
HG
Origin
China
HS Code
6804221000
Production Capacity
10000pieces/Year
Product Description
PCD Grinding Wheels for Processing PDC Drill Bits
1.Ceramic bond diamond grinding wheelAppliable material: Semiconductor wafers and solar wafers, PCD (drill bits),CVD,PCBN,tungsten carbide,engineering structural ceramics,gem,crystal,magnetic material and other hard and brittle material.
2.Resin bond diamond grinding wheelAppliable material :Non metallic materials,tungsten carbide, ceramic, agate, optical glass, semiconductor materials,cast iron,stone and so on.
3.Metal bond diamond grinding wheelAppliable material:Glass,ceramic,silicon wafer,floor slab,marble,granite,concrete,semiconductor materials and super hard materials.
4.FeaturesGood for non metallic materials.
High efficiency and low consumption.
High accuracy.
Good thermal conductivity.
Good self-sharpening.
Less heat in grinding, fewer burned workpiece.
Predictable quality and shape for the workpiece.