1A1r Metal Bond Cut off Wheel, Diamond Cutting Blades

• Blade Type：Continuous Boundary
• Manufacturing Process：Sintered
• Application：Carbide Rod, Glass, Ceramics, Granite Cutting
• Abrasive Material：Diamond
• Bond：Metal Bond
• Cutting Condition：Dry or Wet Cutting

=== Base Info ===

• Model NO.：1A1R DM
• Thickness：0.6 ~ 1.0 mm
• Grit Size：D126, D107, D91
• Transport Package：Carton Box
• Specification：75, 100, 125, 150mm diameter
• Trademark：BOSON Abrasives
• Origin：China
• HS Code：6804211000
• Production Capacity：3000 PCS. , Month

=== Description ===

Basic Info.

Model NO. 1A1R DM Thickness 0.6 ~ 1.0 mm Grit Size D126, D107, D91 Transport Package Carton Box Specification 75, 100, 125, 150mm diameter Trademark BOSON Abrasives Origin China HS Code 6804211000 Production Capacity 3000 PCS. / Month

Product Description

1A1R Metal Bond Cut off Wheel, Diamond Cutting Blades





Diamond Cut-off Wheels are used for efficient cutting of hard, short-chipping and wear resistant materials such as glass, ceramics and carbide, graphite, quartz, ferrite and semiconductor materials.


CBN Cut-off Wheels are used for cutting materials with an affinity for carbon, such as iron-based alloys. High-alloy steels such as HSS and chrome steel with 12% Cr. , hardened steel from 55 HRC and magnetic materials. Soft, long-chipping materials accumulate in the chip space, so they are tend to clog. Compromises can be achieved with electroplated bonds.

Metal bond diamond cut off wheels with steel core is produced with high strength, high rigidity steel plate with sintered metal bonded abrasives layer. Compared with resin bond,  the thickness is thinner with higher rigidity, suitable for deep cutting off or grooving.



The cutting wheels consist of a steel core with the cutting layer on the periphery. The cutting layer in sintered metal, resin or electroplated metal bond contains either diamond or CBN. The combination of bond, type of abrasive, concentration and grit size leads to different tool characteristics which are specified to meet the requirements of different processes and applications.