Wafer Surface Diamond CMP Wheel Disk Blade

=== Base Info ===

• Model NO.：D100-107.95
• Blade Type：Cutter Head
• Manufacturing Process：Electroplating
• Application：Semiconductor
• Standard：Jb,T 7425-2012
• Brand：Diasc
• Dressing：Can Be Dressed
• Grit Size：80#-325#
• Trademark：diasc
• Transport Package：Carton
• Specification：customized
• Origin：China
• HS Code：68042100

=== Description ===