0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting

Shaoxing Yibeauty Packaging Co., Ltd. / 2022-06-27

0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting

  • Application:Stone, Glass,Ceramic etc
  • Type:Electroplating
  • MOQ:1 Roll
  • Custom:Accept
  • Usage:Wet & Dry Working
  • Grit:200#

=== Base Info ===

  • Model NO.:ZL-DX
  • Total Lengh:65 Meter,Roll
  • Transport Package:White Box+Carton
  • Specification:0.3mm 0.4mm 0.45mm 0.5mm 0.6mm 0.8mm 1.0mm 1.2mm a
  • Trademark:ZLION
  • Origin:Xiamen, China
  • HS Code:82029910
  • Production Capacity:10000 Roll,Month

=== Description ===
1.Durable, Strong tensile strength
2.Small diameter, small cutting seam
3.Can be made as long as 200 meters  0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting
0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting0.3mm 0.4mm 0.45mm High Precision Diamond Wire Saw Silicon Wafer Cutting

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