Metal Bond Cutting Blade for Wafering and Dicing

Qingdao Aohai Ruitai Industrial Co., Ltd. / 2022-06-27

Metal Bond Cutting Blade for Wafering and Dicing

    === Base Info ===

    • Kind:Diamond Wheel
    • Manufacturing Arts:Sinter
    • Usage:Stone Cutting, Drilling, Engineering Material, Optical Glass Cutting, Lab Use Super-thin Saw Blade, Semiconductor Cutting, Arts Cutting, Fire-Retardant, Porcelain, Plastics, Laminate Plate
    • Saw Blade External Diameter:150mm

    === Description ===

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