Wafer Hot Adhesive Glue Solution Wafer Debonding Melt Automation Machine

Dongguan Lan Dun mechanical and electrical equipment Technology Co., Ltd. / 2022-06-27

Wafer Hot Adhesive Glue Solution Wafer Debonding Melt Automation Machine

  • After-sales Service:1 Years
  • Warranty:1 Years
  • Weight:20kg
  • UV Main Wave Length:365,385,395,405 Nm
  • Cooling Way:Air Cooling
  • Power Supply:220V 50Hz

=== Base Info ===

  • Model NO.:LDCH-600C
  • Product Material:Aluminum Alloy
  • Feed:Drawer Feeding
  • Protective Gas:Nitrogen
  • Transport Package:Wooden Box Package
  • Specification:600*600*500mm
  • Trademark:Landun
  • Origin:China
  • HS Code:8543709990
  • Production Capacity:5 Sets,Week

=== Description ===

Basic Info.

Model NO. LDCH-600C Product Material Aluminum Alloy Feed Drawer Feeding Protective Gas Nitrogen Transport Package Wooden Box Package Specification 600*600*500mm Trademark Landun Origin China HS Code 8543709990 Production Capacity 5 Sets/Week

Product Description

Wafer Hot Adhesive Melt Automation Machine 

Wafer Hot Adhesive Glue Solution Wafer Debonding Melt Automation Machine
Product advantages
1. It has beautiful appearance, light volume and space saving.
2. Wide application, reliable quality, safe use and convenient operation
3. Easy to operate, one key switch
4. Fast curing speed, improve production efficiency
5. The advanced heat dissipation system automatically controls the heat dissipation time to ensure that the workpiece is not        affected by temperature and prolong the service life of the lamp.
6.Range of application:Semiconductor packaging industry, optical lens, LED, integrated circuit board, mobile hard disk, etc.


Wafer Hot Adhesive Glue Solution Wafer Debonding Melt Automation MachineWafer Hot Adhesive Glue Solution Wafer Debonding Melt Automation MachineWafer Hot Adhesive Glue Solution Wafer Debonding Melt Automation Machine
Wafer Hot Adhesive Glue Solution Wafer Debonding Melt Automation Machine
Wafer Hot Adhesive Glue Solution Wafer Debonding Melt Automation MachineWafer Hot Adhesive Glue Solution Wafer Debonding Melt Automation MachineQ1:How soon can I receive the quotation?
A:  For most projects, once we understand your needs, we can provide you with a quotation within 24 hours.

Q2:Can I customize the solution?
A:  Yes, we design and build each project according to the needs of individual customers.

Q3:What is the delivery time for mass production?
A:  Within 10-15 working days after receiving 100% payment, a 3-day delay is allowed.
      The delivery date of large machines needs to be negotiated.

Q4:What is your delivery period?
A:   We accept EXW, FOB, etc. You can choose the most convenient or cost-effective one.

Q5:How to settle the payment?
A:  50% of the total amount shall be paid in advance by wire transfer, and the remaining 50% shall be paid before the
     delivery price is shown in the USD price, and the customs shall be borne by the customer. All unestablished international
     customers have prepaid. When the purchase order is received, a proforma invoice will be sent via email, which includes
     the freight and bank information used for prepayment.

Q6:How to order us?
A:  Send inquiry to us-------receive quotation-------negotiate order details-------confirm order-------sign contract-------payment
     ------Mass production-------The goods are ready------Delivery--------Further cooperation.

Q7:How do you ensure our quality?
A:  The machine is guaranteed for 1 year. Damage caused by man-made or natural disasters is not covered by this warranty.
      After the warranty period, the company can still provide technical assistance, but a service fee is required.

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